Sequentially coupled thermal-stress analysis

A sequentially coupled heat transfer analysis:

  • is used when the stress/deformation field in a structure depends on the temperature field in that structure, but the temperature field can be found without knowledge of the stress/deformation response; and

  • is usually performed by first conducting an uncoupled heat transfer analysis and then a stress/deformation analysis.

A thermal-stress analysis in which the temperature field does not depend on the stress field is a common example of a sequential multiphysics workflow and is one case of the more general workflow described in Predefined fields for sequential coupling. In such thermal-stress analyses, temperature is calculated in an uncoupled heat transfer analysis (Uncoupled heat transfer analysis) or in a coupled thermal-electrical analysis (Coupled thermal-electrical analysis).

The following topics are discussed:

Related Topics
Defining an analysis
About heat transfer analysis procedures
Predefined fields for sequential coupling
In Other Guides
Creating and modifying output requests
Defining a temperature field