Electromagnetic-to-structural and electromagnetic-to-thermal co-simulation

This section discusses analysis setup and execution details specific to electromagnetic-to-structural and electromagnetic-to-thermal co-simulation using Abaqus/Standard procedures. Co-simulation between a time-harmonic or transient electromagnetic analysis and a static, transient implicit dynamic, coupled temperature-displacement, or transient heat transfer analysis is supported.

An electromagnetic to a heat transfer co-simulation analysis is useful for applications such as induction heating, which involves two-way coupling: the Joule heat production from the electromagnetic analysis drives a heat transfer analysis and determines the temperature distribution, while the temperature distribution, in turn, affects the electromagnetic fields through temperature-dependent material properties (such as electrical conductivity and magnetic permeability). For electromagnetic-to-thermal coupling, co-simulation between a time-harmonic or transient electromagnetic analysis and a transient heat transfer analysis is supported.

An electromagnetic to transient implicit dynamic analysis is useful for applications such as electromagnetic forming, where the Lorentz body forces from an electromagnetic analysis drive a transient dynamic analysis. Co-simulation between a transient electromagnetic analysis and a static or transient implicit dynamic analysis is supported. However, the coupling is only one way; that is, the effects of deformation of parts of the domain (metal work piece, in this case) on the electromagnetic fields is not accounted for. Hence, such analysis should be used only when the effects of deformation on the electromagnetic fields are relatively small.

The following topics are discussed:

Related Topics
About co-simulation
Preparing an Abaqus analysis for co-simulation
In Other Guides
*CO-SIMULATION

ProductsAbaqus/Standard