# GAPCON

 User subroutine to define conductance between contact surfaces or nodes in a fully coupled temperature-displacement analysis, coupled thermal-electrical-structural analysis, or pure heat transfer analysis. User subroutine GAPCON: assumes that the heat transfer between surfaces is modeled as $q=k⁢(θA-θB)$, where q is the heat flux per unit area flowing between corresponding points A and B on the surfaces, k is the gap conductance, and $θA$ and $θB$ are the surface temperatures; is used to define k, providing greater flexibility than direct gap conductance definition in specifying the dependencies of k (for example, it is not necessary to define the gap conductance as a function of the average of the two surfaces' temperatures, mass flow rates, or field variables); will be called at the slave nodes of a contact pair and at the integration points in a contact or a gap element for which the heat conductance definition contains a user-subroutine-defined gap conductance; and ignores any dependencies or data specified for the gap conductance outside the user subroutine. The following topics are discussed:
 Related Topics In Other Guides Thermal contact properties *GAP CONDUCTANCE GAPCON

ProductsAbaqus/Standard