*HEADING
 FILE NAME : MGCOOD1DIN_NEW
 FEATURES TESTED : THREE DIMENTIONAL INTERFACE
                   GAP CONDUCTANCE
                   FV DEP
*NODE,NSET=PLANEA
*NCOPY,CHANGE NUMBER=100,OLD SET=PLANEA,SHIFT,NEW SET=PLANEB
*NCOPY,CHANGE NUMBER=200,OLD SET=PLANEA,SHIFT,NEW SET=PLANEC
*NCOPY,CHANGE NUMBER=300,OLD SET=PLANEA,SHIFT,NEW SET=PLANED
*NSET,NSET=BCPLANE
 PLANEB, PLANEC
*ELEMENT,TYPE=DC3D8,ELSET=ONE
*ELEMENT,TYPE=DC3D8,ELSET=TWO
*ELSET,ELSET=BOTH
ONE,TWO
*SOLID SECTION,ELSET=BOTH,MATERIAL=BLOCK
*MATERIAL,NAME=BLOCK
*CONDUCTIVITY
150.,
*surface,NAME=SURF_01
ONE,S1
*surface,NAME=SURF_02
TWO,S2
*CONTACT PAIR,INTERACTION=GAPC,SMALL SLIDING,ADJUST=0.1
SURF_01,SURF_02
*SURFACE INTERACTION,NAME=GAPC
*GAP CONDUCTANCE,DEPENDENCIES=1
*AMPLITUDE,NAME=RISE
0.,0.,1.,1.
*STEP,AMP=STEP
*HEAT TRANSFER,STEADY STATE
.25,1.,.25,.25
*BOUNDARY
PLANEA,11,11,1000.
PLANED,11,11
*FIELD,VARIABLE=1,AMP=RISE
PLANEB,100.
PLANEC,100.
*EL PRINT
COORD,FV
*NODE PRINT
NT,
*OUTPUT,FIELD
*NODE OUTPUT,NSET=BCPLANE
NT,
*PRINT,CONTACT=YES
*CONTACT PRINT
*OUTPUT,FIELD
*CONTACT OUTPUT,VARIABLE=PRESELECT
*END STEP